Startup · Germany
Lidrotec
HQ GermanyFounded 201911-50 employees
Develops laser-based wafer dicing technology.
Products1
Newest unveiled first. Open a product for its milestone timeline, components and sources.
Funding1 round · €5M
- Disclosed
- €5M
- Latest
- €5.0MSeries A · Dec 26, 2022
| Announced | Stage | Amount | Valuation | Lead investors | Other investors | Confidence |
|---|---|---|---|---|---|---|
| Dec 26, 2022 | Series A | €5.0M | — | — | — | Reported |
- Series A€5.0MDec 26, 2022
Totals add known amounts using recorded USD conversions where available; other currencies are shown separately. A ~ marks an estimated amount.
Sources4
Profile2
- 1
PitchBook · Supports Organization · country, Organization · employee range, Organization · founded year, Organization · linkedin url, Organization · x url
“country: DE”
- 2
Sixth-Domain · Supports Organization · kind
“{"group": "startups", "id": "e61b7373-6169-46da-90ec-e4fcf2167ad5", "name": "Lidrotec"}”
Products1
- 3
Lidrotec · Supports Organization · description, Organization · name, Organization · website, System
“Excellent quality and highest precision in cutting microchips and devices (wafer dicing) are the main features of Lidrotec’s innovative laser technology. With it, we set new standards for a variety of industries: semiconductor, energy, medicine, electronics and material science.”
Funding1
- 4
Nordic9 · Dec 26, 2022 · Supports Funding round · amount
“Lidrotec raised €5M series A.”
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