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Startup · Germany

Lidrotec

HQ Bochum, GermanyFounded 201911-50 employeesUpdated

Develops laser-based wafer dicing technology.

StartupSemiconductors and microelectronics
Website
Total raised
~$5.3M
1 round
Last round
~$5.3M
Series A · Dec 26, 2022
Systems
1
Capabilities
1

Funding1 round · ~$5.3M

Equity raised
~$5.3M
Latest
~$5.3MSeries A · Dec 26, 2022
  • Series A
    ~$5.3M
    Dec 26, 2022

Raised counts equity rounds; debt, secondary sales and grants are totaled separately. Amounts in other currencies are converted at the announcement month's average rate. A ~ marks an estimated or converted amount.

Systems1

  • LidroCUT®LidroCUT® is a laser‑based wafer dicing system that operates in liquids.
    —

Newest unveiled first. Systems that belong to a government program link to the program page, where variants, costs and contracts are.

Capabilities1

  • Semiconductors and microelectronics
    Developer
    classify_sectors run 172, haiku, taxonomy 2026-10-19: Laser-based wafer dicing equipment for semiconductor fabrication, with no stated defense use.
    —Reported

Maturity and TRL describe this organization's work; the field-wide maturity is on each technology's page.

People2

All 2 people →
People
PersonRole
Alexander KanitzCPO & Co-founder
Jan HoppiusCTO & Co-founder

More in Semiconductors and Microelectronics

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Sources6

Profile3

  1. 1
    DatabaseLidrotec - PitchBook company profile

    PitchBook · Supports Organization · country, Organization · employee range, Organization · founded year, Organization · linkedin url, Organization · x url

    “country: DE”
  2. 2
    DatabaseSixth-Domain public startups directory

    Sixth-Domain · Supports Organization · kind

    “{"group": "startups", "id": "e61b7373-6169-46da-90ec-e4fcf2167ad5", "name": "Lidrotec"}”
  3. 3
    DatabaseLIDROTEC company profile

    Octen Business Search · Supports Organization · hq city, Organization · hq region

    “hq_city: Bochum (profile: Lothringer Allee 2, Bochum, North Rhine-Westphalia 44805, DE)”

Systems1

  1. 4
    CompanyLidroCUT® - Laser Dicing in Liquids

    Lidrotec · Supports Organization · description, Organization · name, Organization · website, System

    “Excellent quality and highest precision in cutting microchips and devices (wafer dicing) are the main features of Lidrotec’s innovative laser technology. With it, we set new standards for a variety of industries: semiconductor, energy, medicine, electronics and material science.”

Funding1

  1. 5
    NewsLidrotec raised €5M series A.

    Nordic9 · Dec 26, 2022 · Supports Funding round · amount, Organization · ownership

    “Lidrotec raised €5M series A.”

People1

  1. 6
    CompanyLidrotec - team page

    Lidrotec · Supports Role

    “Jan Hoppius CTO & Co-founder”

Each fact on this page is attached to the sources that support it. Archived copies are linked when we keep one.