Domain
Semiconductors and Microelectronics
Miniaturized electronic components and integrated circuits that sense, process, store, and communicate information.
Maturity not rated
Systems
0
Here and in 8 below
Input links
0
Here and in 8 below
Maturity
Not rated
Field-wide rating
Who Builds It3
No maturity ratings yet for MIT Lincoln Laboratory, Northrop Grumman, RTX
- MIT Lincoln LaboratoryResearcher · USThe cited institution source explicitly documents this capability.—
- Northrop GrummanDeveloper · USNorthrop Grumman’s Microelectronics Center designs, fabricates, assembles, tests and packages custom chips for defense and commercial systems. The company identifies government-accredited semiconductor foundries in California and Maryland and an advanced-packaging facility in Florida.—
- RTXDeveloper · USRaytheon designs and fabricates gallium-nitride semiconductor devices for military radar and sensor applications. The Andover development and production line connects semiconductor fabrication with integration and test of radar assemblies such as SPY-6.—
Placed by each organization's own maturity for this technology; TRL is self-reported or estimated, see confidence.
Breakdown8
- Advanced manufacturing process technologies and equipmentProcesses and equipment for creating semiconductor structures, patterning circuits, and controlling fabrication quality.—
- Beyond complementary metal-oxide-semiconductor (CMOS) technologyDevice and circuit approaches that explore alternatives to conventional CMOS electronics and its scaling limits.—
- Design automation toolsSoftware that supports the design, layout, simulation, and verification of electronic circuits and chips.—
- Heterogeneous integration and advanced packagingCombining different chips, components, and interconnections into a package so they function as an integrated electronic system.—
- Integrated photonicsOptical components integrated onto a chip to generate, guide, modulate, and detect light.—
- Microelectromechanical and Nanoelectromechanical systems (MEMS and NEMS)Miniature devices that combine electrical and mechanical functions, enabling compact sensors, actuators, and other components.—
- Novel materials for advanced microelectronics, including 2D materialsMaterials with properties suited to new electronic devices, including atomically thin layers used to explore alternative chip structures.—
- Specialized hardware components for AI, RF and optical applications, elevated radiation environments, high-power devices, and other critical applicationsElectronic components tailored for specialized workloads or environments, including AI, radio-frequency signals, optics, radiation, and high power.—