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Capability · Semiconductors and microelectronics

Heterogeneous Integration and Advanced Packaging

Combining different chips, components, and interconnections into a package so they function as an integrated electronic system.

Maturity not ratedPart of Semiconductors and microelectronics

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IntelDeveloper · USCompany-reported capability; mapping does not establish government endorsement, supplier qualification or a contract.—

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				Notes	Conf.
IntelUS	Supplier	Developer	—	Company-reported capability; mapping does not establish government endorsement, supplier qualification or a contract.	Reported

Placed by each organization's own maturity for this technology; TRL is self-reported or estimated, see confidence.